We have been delivering integrated RFID solutions for diverse industries, available to propose tags with the optimum performance upon customers’ requirements.
Solution
Analysis and product planning
Read range
RFID products are sensitive to the surrounding environment. We work alongside RFID professionals who will listen to your operating environment and design an optimum antenna
Security
We provide support from the selection of chip type to the setting of encoding content, taking into account the operation method and system content.
Sensor
These tags are equipped with sensors (temperature, humidity, illumination, shock detection, etc.) to streamline the management of all objects.
Size
Through integrated in-house management, complex design aspects, such as minimum size and even challenging shapes of tags are possible.
Durability
RFID products are susceptible to environmental conditions. We develop high performance tags with features and options specific to certain environments from selecting antenna and case base material types.
Design and prototype
RFID IC Circuit manufacturing
Several manufacturing methods are available to be selected from to suit the customers’ requirements.
Antenna manufacturing
Copper wire antenna
Copper has a lower resistance than aluminum, therefore the antenna has a lower resistance, a higher Q factor, and better performance. And also copper wire antenna can be made small.
Aluminum etched antenna
Mass production and cost-effective tags and cards are possible.
Flip chip bonding
The chip is flipped on the substrate during mounting.
It is placed directly on the antenna, and can be made into a product with “space saving” and “high conductivity” feature, compared to wire bonding and other methods.
Spot bonding
This method uses wires to bond the chip and antenna. By welding the wire, the bonding area between the chip and the bump is expanded to realize high durability and conductivity.
Tag housing
We are available to make cases by injection-molding process.
We have know-how to propose base materials with properties such as durability and chemical resistance to suit specific environment.
Casing
Ultrasonic welding
A processing technique where ultrasonic vibration and pressure are applied to thermoplastic resins (ABS/PC/PP, etc.) to weld them together.
Heat welding
A processing that melts and welds materials by heating and applying pressure up to their melting point.
Available in diverse combination of materials using special adhesive.
Resin sealing
Potting and encapsulating resins(Thermosetting/UV hardening/natural hardening) on base materials offers high level protection.
Small lot orders are available.
Design
Silkscreen printing
A printing method pressing ink through a plate to create a printed design.
In addition to colour printing on plastic cases and other materials, special colour printing is also available.
Double injection
Unlike usual injection moulding, which can only produce a single colour, this is a technology combines different materials.
By using different coloured materials, it is possible to create designs on the case.
Laser engraving
Laser engraving in three different wavelengths is available.
Automatic inspection machines with encoding function.
There are several machines in Tokyo factory capable of processing more than one million IC tags per month, simultaneously performing encoding, laser engraving, FQ & read inspection, and thickness inspection. With the in-house software development team, we respond quickly to newly launched ICs.
Valure-added
Packing and sealing
Bagging to prevent damage
On-metal tag
Process for performance in contact with metals.